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-0- specifications for nichia chip type warm white led model : NCSL119T-H1 nichia corporation nichia sts-da1-0868b
-1- 1.specifications (1) absolute maximum ratings (ts=25c) item symbol absolute maximum rating unit forward current i f 100 ~ 700 ma pulse forward current i fp 1000 ma allowable reverse current i r 85 ma power dissipation p d 2.66 w operating temperature t opr -40 ~ +100 c storage temperature t stg -40 ~ +100 c dice temperature t j 135 c soldering temperature t sld reflow soldering : 260c for 10sec. hand soldering : 350c for 3sec. i fp conditions : pulse width 10msec. and duty 1/10 (2) initial electrical/optical characteristics (ts=25c) item symbol condition typ. max. unit forward voltage v f i f =350[ma] (3.3) 3.8 v luminous flux v i f =350[ma] (80) - lm x - i f =350[ma] 0.41 - - chromaticity coordinate y - i f =350[ma] 0.39 - - color rendering r a i f =350[ma] (92) - - forward voltage measurement allowance is 0.05v. luminous flux value is traceable to the cie 127:2007-compliant national standards. please refer to cie 1931 chromaticity diagram. (3) ranking (ts=25c) item symbol condition min. max. unit rank b09 90 100 rank b08 80 90 rank b07 70 80 luminous flux rank b06 v i f =350[ma] 60 70 lm color rendering - r a i f =350[ma] 85 - - luminous flux measurement allowance is 7%. color rendering measurement allowance is 5. color ranks (i f =350ma,ts=25c) rank sw27 rank sw30 x 0.4373 0.4562 0.4813 0.4593 x 0.4147 0.4299 0.4562 0.4373 y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893 nichia sts-da1-0868b
-2- rank sw35 x 0.3898 0.3996 0.4299 0.4147 y 0.3716 0.4015 0.4165 0.3814 color coordinates measurement allowance is 0.005. basically, a shipment shall consist of the leds of a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia. correspondence table of color coordinates ? luminous flux ranks ranking by luminous flux ranking by color coordinates b06 b07 b08 b09 sw27 sw30 sw35 shaded ranks are available. 2.initial optical/electrical characteristics please refer to ?characteristics? on the following pages. 3.outline dimensions and materials please refer to ?outline dimensions? on the following page. 4.packaging the leds are packed in cardboard boxes after taping. please refer to ?taping dimensions ? and ?packing ?on the following pages. the label on the minimum packing unit shows ; part number, lot number, ranking, quantity in order to protect the leds from mechanical shock, we pack them in cardboard boxes for transportation. the leds may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. the boxes are not water resistant and therefore must be kept away from water and moisture. when the leds are transported, we recommend that you use the same packing method as nichia. 5.lot number the first six digits number shows lot number . the lot number is composed of the following characters; - - year ( 8 for 2008, 9 for 2009 ) - month ( 1 for jan., 9 for sep., a for oct., b for nov. ) - nichia's product number - ranking by color coordinates, ranking by luminous flux nichia sts-da1-0868b
-3- 6.reliability (1) test items and results test item standard test method test conditions note number of damaged resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 tsld=260c, 10sec. (pre treatment 30c,70%,168hrs.) 2 times 0/22 solderability (reflow soldering) jeita ed-4701 303 303a tsld=245 5c, 5sec. using flux lead-free solder (sn-3.0ag-0.5cu) 1 time over 95% 0/22 temperature cycle jeita ed-4701 100 105 -40c ~ 25c ~ 100c ~ 25c 30min. 5min. 30min. 5min. 100 cycles 0/22 moisture resistance cyclic jeita ed-4701 200 203 25c ~ 65c ~ -10c 90%rh 24hrs./1cycle 10 cycles 0/22 high temperature storage jeita ed-4701 200 201 ta=100c 1000 hrs. 0/22 temperature humidity storage jeita ed-4701 100 103 ta=60c, rh=90% 1000 hrs. 0/22 low temperature storage jeita ed-4701 200 202 ta=-40c 1000 hrs. 0/22 steady state operating life ta=25c, i f =700ma tested with nichia standard circuit board. 1000 hrs. 0/22 steady state operating life of high temperature ta=100c, i f =200ma tested with nichia standard circuit board. 1000 hrs. 0/22 steady state operating life of high humidity heat 60c, rh=90%, i f =500ma tested with nichia standard circuit board. 500 hrs. 0/22 steady state operating life of low temperature ta=-40c, i f =350ma tested with nichia standard circuit board. 1000 hrs. 0/22 vibration jeita ed-4701 400 403 100 ~ 2000 ~ 100hz sweep 4min. 200m/s 2 3directions, 4cycles 48min. 0/10 electrostatic discharges jeita ed-4701 300 304 r=1.5k ? , c=100pf test voltage=2kv 3 times negative/positive 0/22 thermal resistance of led with nichia standard circuit board : rja P 40c/w nichia standard circuit board : fr4, t=1.6mm, copper foil, t=0.07mm (2) criteria for judging damage criteria for judgement item symbol test conditions min. max. forward voltage v f i f =350ma - initial level 1.1 luminous flux v i f =350ma initial level 0.7 - the test is performed after the board is cooled down to the room temperature. nichia sts-da1-0868b
-4- 7.cautions the leds are devices which are materialized by combining blue leds and special phosphors. consequently, the color of the leds is changed a little by an operating current. care should be taken after due consideration when using leds. (1) moisture proof package when moisture is absorbed into the smt package it may vaporize and expand during soldering. there is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the leds. for this reason, th e moisture proof package is used to keep moisture to a minimum in the package. the moisture proof package is made of an aluminum moisture proof bag. a package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. the silica gel changes its color from blue to red as it absorbs moisture. (2) storage storage conditions before opening the package : the leds should be kept at 30c or less and 90%rh or less. the leds should be used within a year. when storing the leds, moisture proof packaging with absorbent material (silica gel) is recommended. after opening the package : the leds should be kept at 30c or less and 70%rh or less. the leds should be soldered within 168 hours (7days) after opening the package. if unused leds remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). it is also recommended to return the leds to the original moisture proof bag and to reseal the moisture proof bag again. if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following condition. baking treatment : more than 24 hours at 65 5c nichia led electrodes are gold plated. the gold surface may be affected by environments which contain corrosive substances. please avoid conditions which may cause the led to corrode, tarnish or discolor. this corrosion or discolor ation may cause difficulty during soldering operations. it is recommended that the customer use the leds as soon as possible. please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. nichia sts-da1-0868b
-5- (3) static electricity static electricity or surge voltage damages the leds. it is recommended that a wrist band or an anti-electrostatic glove be used when handling the leds. all devices, equipment and machinery must be properly grounded. it is recommended that precautions be taken against surge voltage to the equipment that mounts the leds. when inspecting the final products in which leds were assembled, it is recommended to check whether the assembled leds are damaged by static electricity or not. it is easy to find static-damaged leds by a light-on test or a vf test at a lower current (below 1ma is recommended). damaged leds will show some unusual characteristics such as the forward voltage becomes lower, or the leds do not light at the low current. criteria : (v f > 2.0v at i f =0.5ma) (4) application design considerations in designing a circuit, the current through each led must not exceed the absolute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing through each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the current through the leds may vary due to the variation in forward voltage (v f ) of the leds. in the worst case, some led may be subjected to stresses in excess of the absolute maximum rating. this product should be operated in forward bias. a driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in led damage. pulse width modulation (pwm) is recommended for dimming leds as color point changes with drive current. this product is intended to be used at or near its nominal drive current and characterized at the nominal current. it is not recommended to drive the leds at low current. (a) (b) ... ... nichia sts-da1-0868b
-6- thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric power is affected by the thermal resistan ce of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. please determine the operating current with consid eration of the ambient temperature local to the led and refer to the plot of ambient temperatur e vs. allowable forward current on characteristics in this specifications. please also take measures to remove heat from the area near the led to improve the operational characteristics of the led. the equation 1 indicates correlation between tj and ta, and the equation 2 indicates correlation between tj and ts1. tj=ta + rja w 1 tj=ts1 + rjs1 w 2 tj = dice temperature : c, ta = ambient temperature : c, ts1 = solder temperature (cathode side) : c, rja = heat resistance from dice to ambient temperature : c /w, rjs1 = heat resistance from dice to ts1 measuring point P 13c /w, w = inputting power (i f v f ) : w anode cathode ts1 point nichia sts-da1-0868b
-7- warpage of circuit board with soldered leds ma y result in damage or package breakage of the leds. please pay special attention to the orientation of the leds as to avoid led failure caused by bow, twist and warpage of the board. when mechanical stress from the board affect s the soldered led, place the led in the preferable location and orientation as shown above. depending on the position and direction of led, the mechanical stress on the led package can be changed. refer to the following figure. perforated line slit stress : a > b = c > d > e when separating the circuit boards with soldered leds, please use appropriate tools and equipment. hand brake without these tools and equipment may not be used. the use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. customers may need to evaluate their specific application to determine any impact due to the use of aluminum substrate. non-preferable preferable cathode mark cathode mark nichia sts-da1-0868b
-8- (5) handling precautions bare hand when handling the product, touching encapsulant with bare hands will contaminate its surface that could affects on optical characteristics. in the worst cases, excessive force to the encapsulant by hands might result in catastrophic failure of the leds due to wire deformation and/or breakage. tweezers when handling it with tweezers, the product should only be held by the ceramics body, not by the encapsulant. failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases, catastrophic failure of the leds due to wire deformation and/or breakage. pick and place the use of appropriate nozzle for this product is recommended. (for the recommended nozzle size, refer to the figure at right.) avoid direct contact to the resin lens with the picking up nozzle. failure to comply might result in catastrophic failure of the leds due to wire deformation and/or breakage. printed circuit board assembled (pcb with leds soldered) do not stack assembled pcbs together. since silicone is a soft material, abrasion between two pcb assembled with silicone encapsulated led might cause catastrophic failure of the leds due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and led detachment. 0.4 3 3.8 1.9 (unit : mm) nichia sts-da1-0868b
-9- (6) soldering conditions the leds can be soldered in place using the reflow soldering method. nichia cannot make a guarantee on the leds after they have been assembled using the dip soldering method. recommended soldering conditions reflow soldering hand soldering lead solder lead-free solder pre-heat pre-heat time peak temperature soldering time condition 120 ~ 150c 120 sec. max. 240c max. 10 sec. max. refer to temperature - profile 1 . 180 ~ 200c 120 sec. max. 260c max. 10 sec. max. refer to temperature - profile 2 . (n 2 reflow is recommended.) temperature soldering time 350c max. 3 sec. max. (one time only) although the recommended soldering conditions are sp ecified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the leds. a rapid-rate process is not recommended for cooling the leds down from the peak temperature. [temperature-profile (surface of circuit board) ] use the conditions shown to the under figure. [recommended soldering pad design] use the following conditions shown in the figure. occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. it is recommended that the customer use the nitrogen reflow method. repairing should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. reflow soldering should not be done more than two times. when soldering, do not put stress on the leds during heating. (unit : mm) 4.1 3.5 0.6 < 1 : lead solder> < 2 : lead-free solder> 120sec.max. pre-heating 260c max. 10sec. max. 60sec.max. above 220c 1 ~ 5c / sec. 1 ~ 5c / sec. 180 ~ 200c pre-heating 240c max. 10sec. max. 60sec.max. above 200 c 2.5 ~ 5c / sec. 2.5 ~ 5c / sec. 120 ~ 150c 120sec.max. nichia sts-da1-0868b
-10- (7) cleaning it is recommended that isopropyl alcohol be used as a solvent for cleaning the leds. when using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. freon solvents should not be used to clean the leds because of worldwide regulations. do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. before cleaning, a pre-test should be done to confirm whether any damage to the leds will occur. (8) safety guideline for human eyes the international electrical commission (iec) published in 2006 iec 62471: 2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep in mind that some countries and regions have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. following iec 62471:2006, most of nichia leds can be classified as belonging to either exempt group or risk group 1. optical characteristics of a led such as radiant flux, spectrum and light distribution are factors that affect the risk gr oup determination of the led. especially a high-power led, that emits light containing bl ue wavelengths, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which may greatly increase the hazard to your eyes. (9) others ncsl119-h1 complies with rohs directive. flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. also, people should be cautious when using equipment that has had leds incorporated into it. the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia?s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disa ssembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the formal specifications must be exchanged and signed by both parties before large volume purchase begins. the appearance and specifications of the product may be modified for improvement without notice. nichia sts-da1-0868b
-11- color coordinates measurement allowance is 0.005. ?? ici chromaticity diagram sw27 sw35 sw30 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x y 460 470 480 490 500 510 520 530 540 550 560 570 580 590 600 610 620 630 nichia sts-da1-0868b
943444 S if (ma) allowable forward current if (ma) ?? ta () ambient temperature ta () tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -30 0 30 60 90 120 ?? ta () ambient temperature ta () ??-?R ambient temperature vs. forward voltage duty 100 1000 10000 1 10 100 700 taiv 0.1 1.0 10.0 -60 -30 0 30 60 90 120 derating 0 200 400 600 800 1000 0 30 60 90 120 rja=20/w rja=30/w rja=40/w ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 200 400 600 800 1000 1200 vfif 10 100 1000 2.0 2.5 3.0 3.5 4.0 4.5 350 ?Rvf (v) forward voltage vf (v) ?R forward voltage vs. forward current ifp (ma) forward current ifp (ma) ?`?` () duty ratio (%) ?`?`?S duty ratio vs. allowable forward current ifp (ma) forward current ifp (ma) ?R vf (v) forward voltage vf (v) S ifp (ma) allowable forward current ifp (ma) ta=25 ta=25 ta=25 350ma i fp= (a.u.) relative luminous flux (a.u.) (a.u.) relative luminous flux(a.u.) - forward current vs. relative luminous flux ncsl119-hx ?/? characteristics model ? n o. nichia corporation ??I () title 090715 -12- 350ma i fp= ??- ambient temperature vs. relative luminous flux ?? ta () ambient temperature ta () ??-S ambient temperaturevs. allowable forward current (85,700) (100,492) (35,700) (100,246) (60,700) (100,328) 100ma???? do not use current below 100ma. do not use current below i f 100ma. * 100ma???? nichia sts-da1-0868b
944291 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 1.2 400 500 600 700 800 ifxy 0.37 0.38 0.39 0.40 0.41 0.39 0.40 0.41 0.42 0.43 ? directivity taxy 0.37 0.38 0.39 0.40 0.41 0.39 0.40 0.41 0.42 0.43 x -? forward current vs. chromaticity coordinate y L (nm) wavelength (nm) k??? spectrum k? (a.u.) relative emission intensity (a.u.) x ??-? ambient temperature vs. chromaticity coordinate y directivity 90 80 70 60 50 40 30 20 10 -10 -20 -30 -40 -50 -60 -70 -80 -90 1 0.5 0 0.5 1 0 ta=25 ta=25 350ma i fp= 350ma i fp= ncsl119-h1 090611 ?/? characteristics model ? n o. nichia corporation ??I () title -13- ??(a.u.) relative illuminance(a.u.) ? radiation angle ta=25 350ma i fp= 20ma 350ma 1000ma -40 0 25 50 100 nichia sts-da1-0868b
ncsx119-hx 090611943412 0.2 ??I () nichia corporation title ? no. ? outline dimensions mm model unit g allow u???????o?i?? ? (note) ncsx119-hx has a protection device built in as a protection circuit against static electricity. ? item ??`| package ?? encapsulating resin ?O electrodes | materials lens ?? ceramics ?`? w silicone resin (with phosphor) ? au plating ?`? silicone resin o protection device ka -14- cathode mark 3.5 3.5 2.6 0.45 anode cathode 0.5 3.17 1.4 3.17 2 nichia sts-da1-0868b
3.7 0.1 0.25 0.05 2.25 0.1 -15- 3,500/` quantity 3,500pcs/reel jis c 0806???`???? taping is based on the : packaging of electronic components on continuous tapes. 090611943422 ncsx119t-hx ?`/` trailer part/leader part led?? leds mounting part ???`?` top cover tape pull direction ?`min.160mm ? trailer part min.160mm (no leds) min.100mm ? reel lead min.100mm (no leds) `min.400mm leader part min.400mm `? reel part 1 3 0 . 2 330 2 80 1 ? label 2 1 0 . 8 cathode mark 1.75 0.1 8 0.1 2 0.05 4 0.1 5.5 0.05 12 +0.3 - 0.1 ?`??? taping part - 0 1.5 +0.1 ??I () nichia corporation title ? no. ?`?? taping dimensions model mm unit g 17.5 1 13.5 1 - 0 1.5 +0.2 ???` embossed carrier tape when led surface-mounting machines are used, special nozzles are required. ? (note) g?C???? ???? 3.7 0.1 nichia sts-da1-0868b
nichia led ?`?? the box is partitioned with the cardboard. ncsx119t-hx xxxx led ncsx119t-hx 090611943432 ????`???? ?`??? the reel and moisture absorbent material are put in the moistur e proof foil bag and then heat sealed. -16- y? packing ??I () nichia corporation model title ? no. ? label ? moisture absorbent material ?? moisture proof foil bag ?` seal ` reel ncsx119t-hx xxxx led rohs pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan ? label yg packing unit 3,500 max. ` reel/bag ?? moisture proof foil bag ?? quantity/bag(pcs) 1reel 5reel max. 17,500 max. s 3913791498t ` reel/box ?? quantity/box(pcs) y ?` cardbord box ? dimensions(mm) rohs nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. xxxxxx- pcs nichia sts-da1-0868b

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